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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
LAPIS SEMICONDUCTOR CO LTD	2-4-8 SHINYOKOHAMA KOUHOKU-KU YOKOHAMA-SHI KANAGAWA 222-8575

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Harada, Yusuke	Tokyo, JP	35	616
# of filed Patents : 35 Total Citations : 616

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Patent Citation Ranking

• 2 Citation Count
• H01L Class

• 2.46 % this patent is cited more than
• 15 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
August 17, 2010	US,7777337,B2   US7777337B2	GRANTED PATENT AS SECOND PUBLICATION
October 02, 2003	US,20030183942,A1   US20030183942A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 7777337

Semiconductor device having damascene interconnection structure that prevents void formation between interconnections

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Abstract

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A semiconductor device includes a first insulating layer having a through hole; a first interconnection having a first conductive layer, a first barrier layer, and a first main interconnection; and a second interconnection connected to one of the first conductive layer and the first barrier layer. Accordingly, a problem wherein copper in the first main interconnection transfers from a connection portion thereof to the second interconnection due to electromigration, so that a void is formed at the connected portion resulting in the first interconnection being disconnected from the second interconnection, can be prevented.

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Description

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Claims

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Legal Events

 

• LAPS2018
• STCH2018
• FP2018
• FEPP2018
• FPAY2014
• AS2011
• I2010
• AS2008
• P2003
• F2003
• AS2003
• PD1998

Date	Code	Event	Description
Sep 24, 2018	LAPS	LAPSE FOR FAILURE TO PAY MAINTENANCE FEES	free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY
Sep 24, 2018	STCH	INFORMATION ON STATUS: PATENT DISCONTINUATION	free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362
Aug 17, 2018	FP	LAPSED DUE TO FAILURE TO PAY MAINTENANCE FEE	Effective Date: Aug 17, 2018
Apr 02, 2018	FEPP	FEE PAYMENT PROCEDURE	free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.)
Jan 22, 2014	FPAY	FEE PAYMENT	year of fee payment: 4
Oct 03, 2011	AS	ASSIGNMENT	free format text: CHANGE OF NAME;ASSIGNOR:OKI SEMICONDUCTOR CO., LTD;REEL/FRAME:032495/0483 Owner name: LAPIS SEMICONDUCTOR CO., LTD., JAPAN Effective Date: Oct 03, 2011
Aug 17, 2010	I	Issuance
Oct 01, 2008	AS	ASSIGNMENT	free format text: CHANGE OF NAME;ASSIGNOR:OKI ELECTRIC INDUSTRY CO., LTD.;REEL/FRAME:022343/0290 Owner name: OKI SEMICONDUCTOR CO., LTD., JAPAN Effective Date: Oct 01, 2008
Oct 02, 2003	P	Published
Mar 27, 2003	F	Filing
Feb 05, 2003	AS	ASSIGNMENT	free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HIHN, ERWIN;HALBMEYER, AXEL;PALESCH, JOHANNES;REEL/FRAME:014184/0804 Owner name: EISENMANN MASCCHINENBAU KG, GERMANY Effective Date: Feb 05, 2003
Jun 11, 1998	PD	Priority Date