Chip-type light emitting device and wiring substrate for the same
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United States of America Patent
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Aug 17, 2010
Grant Date -
Jan 15, 2009
app pub date -
Sep 6, 2005
filing date -
Sep 7, 2004
priority date (Note) -
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Abstract
. This reflector substrate is disposed and adhered on an upper surface of the base substrate, at such the position that portions of the wiring patterns are exposed through the through hole thereof, and the plural number of the light emitting diodes are connected to the wiring patterns on the base substrate, to be mounted thereon.
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