Semiconductor device and process for manufacturing the same
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United States of America Patent
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Aug 17, 2010
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app pub date -
Aug 9, 2007
filing date -
Aug 30, 2004
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Abstract
The present invention relates to a semiconductor device in which electrodes formed on a semiconductor chip and electrodes formed on a wiring board are electrically connected via projecting elastic electrodes, and further relates to a mounting method of reducing a pressure applied to electrodes formed on a substrate or underlying wirings when a semiconductor chip and a wiring board are bonded.
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