Heat sink member and method of manufacturing the same
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United States of America Patent
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Aug 17, 2010
Grant Date -
Nov 2, 2006
app pub date -
Jul 27, 2005
filing date -
Aug 10, 2004
priority date (Note) -
Expired
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Abstract
A heat sink member capable of suppressing development of cracks and chaps in manufacturing, suppressing enlargement of a thermal expansion coefficient and suppressing lowering of thermal conductivity is obtained. This heat sink member comprises a ply member (1) mainly composed of Cu, a substrate (2) mainly composed of Mo and a brazing layer (4) consisting of an Sn--Cu alloy (Sn: 1 mass % to 13 mass %) arranged between the ply member and the substrate for bonding the ply member and the substrate to each other.
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