Package structure for integrated circuit device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 10, 2010
Grant Date -
Nov 13, 2008
app pub date -
May 6, 2008
filing date -
May 8, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A package structure for packaging at least one of a plurality of integrated circuit devices of a wafer is provided. The package structure includes an extension metal pad, a first conductive bump and an insulator layer. The extension metal pad electrically contacts the at least one of the plurality of integrated circuit devices. The first conductive bump is located on the extension metal pad. The insulator layer is located over the at least one of the plurality of integrated circuit devices and on a sidewall of it.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully