Integrated antenna and chip package and method of manufacturing thereof
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United States of America Patent
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Aug 3, 2010
Grant Date -
Aug 20, 2009
app pub date -
Feb 15, 2008
filing date -
Jun 22, 2007
priority date (Note) -
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Abstract
An integrated antenna and chip package and method of manufacturing thereof. The package includes a first substrate having a first surface and a second surface, The second surface is configured to interface the chip package to a circuit board. A second substrate of the package is disposed on the first surface of the first substrate and is made of a dielectric material. One or more antennas are disposed on the second substrate and a communication device is coupled to the antenna, wherein the communication device is disposed on the second substrate in substantially the same plane as the antenna. A lid is coupled to the first substrate and is configured to encapsulate the antenna and the communication device. The lid has a lens that is configured to allow radiation from the antenna to be emitted therethrough and a shoulder configured to transfer heat produced from the communication device.
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