Dicing die attachment film and method for packaging semiconductor using same
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United States of America Patent
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Aug 3, 2010
Grant Date -
Apr 9, 2009
app pub date -
Feb 14, 2007
filing date -
Feb 14, 2006
priority date (Note) -
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Abstract
A dicing die attachment film includes a die attachment layer attached to one surface of a semiconductor wafer; a dicing film layer attached to a dicing die that is used for cutting the semi-conductor wafer into die units; and an intermediate layer laminated between the die attachment layer and the dicing film layer. The intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer.
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