Robotic die sorter with optical inspection system
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United States of America Patent
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Jul 27, 2010
Grant Date -
Jan 17, 2008
app pub date -
Jul 11, 2006
filing date -
Jul 11, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A robotic die sorter having pick and place arm assemblies and a multi-camera optical inspection system is disclosed. A pick arm of the pick arm assembly picks a die from a semiconductor wafer, and a place arm of the place arm assembly receives the die from the pick arm and places same in a reel of pocketed tape. After picking, the pick arm and the place arm are rotated into facing arrangement, whereupon the die is transferred to the place head of the place arm and a camera of the optical inspection system to detect defects in the die. After inspection, the place arm rotates toward the pocketed tape and places the die into the pocketed tape. Additional cameras of the optical inspection system allow for calibration of the pick and place arms, as well as monitoring of the die transfer process.
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