Substrate stage and heat treatment apparatus
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United States of America Patent
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Jul 27, 2010
Grant Date -
Jan 31, 2008
app pub date -
Jul 18, 2007
filing date -
Jul 26, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A stage body has a holding surface for placing a substrate thereon. A predetermined embossed configuration is formed by embossing on the holding surface, and thereafter an alumina film in an amorphous state is formed by an anodic oxidation process on the holding surface. The alumina film having an amorphous structure is dense and strong to provide high wear resistance and to substantially prevent separation electrification. This provides a substrate stage having high wear resistance and capable of preventing separation electrification.
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