Structure with semiconductor chips embeded therein
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United States of America Patent
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Jul 27, 2010
Grant Date -
Jun 28, 2007
app pub date -
Oct 27, 2006
filing date -
Dec 23, 2005
priority date (Note) -
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Abstract
An embedded semiconductor chip structure and a method for fabricating the same are proposed. The structure comprises: a carrier board, therewith a plurality of through openings formed in the carrier board, and through trenches surrounding the through openings in the same; a plurality of semiconductor chips received in the through openings of the carrier board. Subsequently, cutting is processed via the through trenches. Thus, the space usage of the circuit board and the layout design are more efficient. Moreover, shaping time is also shortened.
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