Polishing pad and cushion layer for polishing pad

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United States of America Patent

PATENT NO 7762870
APP PUB NO 20060148393A1
SERIAL NO

11366981

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A polishing pad includes a polishing layer having abrasive grains dispersed in a resin and is characterized in that the resin is a resin containing ionic groups in the range of 20 to 1500 eq/ton.

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Patent Owner(s)

Patent OwnerAddress
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC451 BELLEVUE ROAD NEWARK DE 19713

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Komai, Shigeru Ohtsu, JP 11 543
Nakamori, Masahiko Ohtsu, JP 28 623
Ono, Koichi Ohtsu, JP 140 1559
Shimomura, Tetsuo Ohtsu, JP 29 762
Tsutsumi, Masayuki Ohtsu, JP 17 419
Yamada, Takatoshi Ohtsu, JP 40 697

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