Optical data transceivers
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United States of America Patent
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Jul 20, 2010
Issued Date -
N/A
app pub date -
Feb 7, 2006
filing date -
Feb 9, 2005
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An optical data transceiver is manufactured by forming an integrated control circuit (101) on a suitable substrate, such as a silicon wafer, and then mounting said integrated circuit (101) onto the lead frame (102). Electrical connections may then be made between said integrated circuit (101) and said lead frame (102). The combined assembly comprising the integrated circuit (101) and lead frame (102) is then inserted into the cavity of a mold tool (not shown). A suitable molding compound is injected to encapsulate the combined assembly. The mold tool is provided with a projection (not shown) that is in contact with a portion of the surface of the integrated circuit (101) when the assembly is in the mold tool. As a result, the opening (106), exposing that portion of the surface of the integrated control circuit (101) that was in contact with the projection of the mold tool, is provided. The cavity of the mold tool is also adapted so as to form a rim (107) around the opening (106) during the encapsulation process. After the encapsulation process is complete, an optically active element (105) is then connected to the integrated circuit (101).
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