Method for manufacturing coreless packaging substrate
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United States of America Patent
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Jul 13, 2010
Grant Date -
Aug 14, 2008
app pub date -
Feb 5, 2008
filing date -
Feb 9, 2007
priority date (Note) -
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Abstract
Method for making a coreless packaging substrate are disclosed in the present invention. The coreless packaging substrate is made by first providing a metal adhesion layer having a melting point lower than that of the substrate, and removing a core board connected with the substrate therefrom through melting the metal adhesion layer. In addition, the disclosed packaging substrate further includes a circuit built-up structure of which has the electrical pads embedded under a surface. The disclosed packaging substrate can achieve the purposes of reducing the thickness, increasing circuit layout density, and facilitating the manufacturing of the substrate.
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