Printed circuit board and method of manufacturing semiconductor package using the same
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United States of America Patent
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Jul 6, 2010
Grant Date -
Jul 12, 2007
app pub date -
Jan 10, 2007
filing date -
Jan 11, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
Provided is a printed circuit board having a structure that can prevent the generation of cracks around a rectangular hole and a method of manufacturing a printed circuit board for a semiconductor package. The printed circuit board includes a base substrate in which at least one window slit is formed, a plurality of circuit patterns formed at least on a side surface of the base substrate, a protective layer formed on the base substrate and the circuit patterns, and a crack preventive layer that is formed along at least a portion of edges of the window slit and is not formed at least on the circuit patterns.
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