White LED package structure having a silicon substrate and method of making the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 22, 2010
Grant Date -
Aug 14, 2008
app pub date -
Apr 18, 2007
filing date -
Feb 8, 2007
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A white light emitting diode package structure having a silicon substrate is disclosed. The white light emitting diode package structure comprises a silicon substrate having a plurality of cup-structures thereon, one of a plurality of blue light emitting diodes is respectively disposed in each cup-structure, and a phosphor structure covering the silicon substrate and the cup-structures. The blue light emitting diodes have various wavelengths and the phosphor structure has a plurality of kinds of phosphor powders and a sealing material. Each kind of phosphor powder is able to convert blue light within a certain wavelength into yellow light.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully