Embedded type multifunctional integrated structure for integrating protection components and method for manufacturing the same
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United States of America Patent
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Jun 22, 2010
Grant Date -
Jul 9, 2009
app pub date -
Jan 9, 2008
filing date -
Jan 9, 2008
priority date (Note) -
Expired
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Abstract
An embedded type multifunctional integrated structure for integrating protection components and a method for manufacturing the same are disclosed. The present invention utilizes the concept of multi-layer design to integrate more than two passive components on a component structure that is adhered onto a substrate and is applied to a USB terminal in order to protect an electronic device that uses the USB. Hence, the present invention has an OCP function, an OVP function, and an anti-ESD function at the same time. Therefore, the present invention effectively integrates two or more passive components in order to increase functionality. Moreover, the present invention effectively reduces the size of the passive components on a PCB and reduces the number of solder joints.
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