Method of making integrated circuit package with transparent encapsulant
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United States of America Patent
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Jun 22, 2010
Grant Date -
Nov 20, 2008
app pub date -
Jun 30, 2008
filing date -
Dec 31, 2003
priority date (Note) -
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Abstract
A method for making an IC package with transparent encapsulant includes providing a leadframe, where the leadframe includes a first die pad and a second die pad, disposing a first die on the first die pad and a second die on the second die pad, forming a cavity on the leadframe, where the cavity includes the first die pad and the second die pad, injecting an encapsulant material into the cavity and cutting the injected encapsulant material and the leadframe to form a first IC package and a second IC package. The encapsulant material is transparent for visible wavelengths. The injection of the encapsulant material is performed at an encapsulant temperature ranging from 140° C. to 160° C.
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