Stackable semiconductor package and method for its fabrication
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 15, 2010
Grant Date -
May 24, 2007
app pub date -
Nov 17, 2006
filing date -
Nov 21, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A stackable semiconductor package includes a board having first electrical connections, an integrated circuit chip fixed on a front face of the board, second electrical connections which connect the chip to the first electrical connections of the board and front electrical contact terminals arranged beyond at least one edge of the chip on the front face of this board. An encapsulation block of a coating material is formed on the front face of the board and encapsulates the chip, its electrical connections and the front terminals. The block has at least one opening which at least partially uncovers the front terminals with a view to receiving electrical connection beads of a stacked second package. This one opening is preferably in the form of a groove.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully