Transport pod with protection by the thermophoresis effect
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United States of America Patent
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Jun 15, 2010
Grant Date -
Oct 27, 2005
app pub date -
Apr 20, 2005
filing date -
Apr 21, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A transport pod (1) of the invention for a mask or a semiconductor wafer (2) comprises a leakproof peripheral wall (3) surrounding an inside space (4) receiving the mask or the semiconductor wafer (2). Thermally conductive support means (11) hold the mask or the semiconductor wafer (2). A cold plate (7) thermally coupled to a cold source (8) generates a temperature gradient facing the main face (6) of the mask or the semiconductor wafer (2) that is to be protected against particulate pollution. The cold plate (7) is held by connection means (7b) including thermal insulation means (7c). An on-board energy source (9) powers the cold source (8). This significantly reduces deposition of polluting particles on the main face (6) of the mask or the semiconductor wafer (2).
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