Method for manufacturing a multilayer wiring board
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United States of America Patent
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Jun 15, 2010
Grant Date -
Dec 25, 2008
app pub date -
Apr 8, 2008
filing date -
May 14, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A method of manufacturing a multilayer wiring board is provided. A flat surface is formed on a surface of a multilayer wiring layer, and resistive material is deposited on the flat surface. The multilayer wiring board comprises a multilayer wiring layer on whose surface convexo-concave is formed, a dummy layer burying the convexo-concave, a resistance material layer made of an electrical resistance material deposited on the dummy layer and at an area going beyond the dummy layer, and a wire made of a conductive material deposited on the resistance material layer and ranging from the area going beyond the dummy layer to a part of the flat surface area of the dummy layer, wherein a resistive element is formed at an area of the resistance material layer that the wire does not reach.
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