Structure for protecting electronic packaging contacts from stress
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United States of America Patent
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Jun 8, 2010
Grant Date -
May 3, 2007
app pub date -
Sep 6, 2006
filing date -
Oct 31, 2005
priority date (Note) -
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Abstract
A structure for protecting electronic package contacts is provided. The structure includes at least an electronic contact mounted on a chip, a dielectric layer, a conductor trace line and a protective layer. The protective layer is used to prevent stresses from being gathered within electronic contacts on the chip through surroundingly covering the conductor trace line.
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