Flip chip mounting method by no-flow underfill
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United States of America Patent
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Jun 8, 2010
Issued Date -
N/A
app pub date -
Sep 19, 2007
filing date -
Dec 20, 2006
priority date (Note) -
Expired
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Abstract
In a flip shop mounting method by a no-flow underfill in which resin is pre-coated on a substrate 52, and, thereafter, a semiconductor 50 with bump is mounted on the substrate 52 to join a pad electrode 53 on the substrate 52 to the bump 51, a resin 54a highly filed with the filler 55 is applied to a region except for the pad electrode 53 on the substrate 52, a resin 54b being free from the filler is applied to a pad electrode 53 portion on the substrate 52, and, thereafter, the semiconductor 50 with bump is mounted at a predetermined position on the substrate 52.
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