High capacity pick and place process

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7730611
APP PUB NO 20080240893A1
SERIAL NO

12052948

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of accurately placing an object with a pick and place machine provides raw material. A desired surface topography is created in the raw material. The raw material is diced into parts using a bevel cut so that each of the parts has bevel surfaces. A fixture is provided that has a plurality of spaced cavities with each cavity having bevel surfaces constructed and arranged to mate with the bevel surfaces of an associated part. A pick and place machine picks and places each part into an associated cavity such that the bevel surfaces of the part mates with the bevel surfaces of the cavity.

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Patent Owner(s)

Patent OwnerAddress
SIEMENS ELECTRONICS ASSEMBLY SYSTEMS LLC2875 NORTHWOOD PARKWAY NORCROSS GA 30071

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Becker, Ulf Alpharetta, US 1 0
Halk, David Cummings, US 3 15

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