Compressive conductors for semiconductor testing
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United States of America Patent
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Jun 1, 2010
Grant Date -
N/A
app pub date -
Feb 6, 2007
filing date -
Feb 6, 2006
priority date (Note) -
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Abstract
An interconnect assembly electrically connecting two circuit members, which include respective arrays of electrical contacts for engagement with the interconnect assembly. The interconnect assembly comprises a plurality of electrical conductors, the plurality of conductors arranged in a spaced arrangement, the spaced arrangement of the conductors substantially corresponding to a spaced arrangement for the respective arrays of electrical contacts to provide contact between the conductors and the contact arrays and a carrier, including a socket and a retainer. The socket includes a plurality of apertures each receiving an upper portion of one of the plurality of conductors and the retainer includes a plurality of apertures each receiving a lower portion of one of the plurality of conductors; and the respective apertures are aligned axially with each other.
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