Apparatus and method for arranging devices for processing
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 1, 2010
Issued Date -
N/A
app pub date -
Dec 12, 2005
filing date -
Dec 12, 2005
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus is provided for arranging for processing a semiconductor device having surface components on its surface. A device support comprising a set of protrusions for contacting a surface of the semiconductor device supports the semiconductor device on a plane. The protrusions are arranged and positioned such that they avoid contact with the surface components on the surface. In order to grip the semiconductor device supported on the plane, a clamping device having a first set of clamps is configured for gripping the semiconductor device along a first axis and a second set of clamps is configured for gripping the semiconductor device along a second axis perpendicular to the first axis.
First Claim
Other Claims data not available
