Composition providing through plane thermal conductivity
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United States of America Patent
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May 25, 2010
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N/A
app pub date -
Sep 16, 2008
filing date -
Sep 17, 2007
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Abstract
This specification discloses a conductive composition relying upon spherical boron nitride particles and thermally expanded graphite to impart high through-plane thermal conductivity in thermoplastics for use in hot environments, including the electronics industry.
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