Circuit board structure with embedded semiconductor chip and method for fabricating the same
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United States of America Patent
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May 18, 2010
Grant Date -
May 22, 2008
app pub date -
Oct 5, 2007
filing date -
Nov 21, 2006
priority date (Note) -
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Abstract
The present invention provides a circuit board structure with an embedded semiconductor chip and a method for fabricating the same. The circuit board structure includes a carrier board having a first surface, a second surface, and a through hole penetrating the carrier board from the first surface to the second surface; a semiconductor chip having an active surface whereon a plurality of electrode pads are formed and a non-active surface, embedded in the through hole; a photosensitive first dielectric layer formed on the first surface of the carrier board and an opening formed thereon to expose the non-active surface of the semiconductor chip; a photosensitive second dielectric layer formed on the second surface of the carrier board and the active surface of the semiconductor chip.
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