Shapes-based migration of aluminum designs to copper damascene
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United States of America Patent
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-
May 4, 2010
Grant Date -
Nov 29, 2007
app pub date -
Aug 13, 2007
filing date -
Sep 26, 2000
priority date (Note) -
Expired
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Abstract
An interconnect structure, method of fabricating the interconnect structure and method of designing the interconnect structure for use in semiconductor devices. The interconnect structure includes a damascene metal wire having a pattern of dielectric filled holes.
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