Semiconductor device
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United States of America Patent
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May 4, 2010
Grant Date -
Jul 9, 2009
app pub date -
Dec 22, 2008
filing date -
Dec 25, 2007
priority date (Note) -
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Abstract
In a multi-chip package semiconductor device, a drive chip having an analog circuit and a logic chip having a digital circuit are mounted within the same package. The driver chip includes a logic-chip power-supply circuit that makes up a logic-chip power supply for the logic chip and a group of operational amplifiers that amplify detection signals from a plurality of sensors. The driver chip has the shape of a square as a whole, and the plurality of operational amplifiers and the logic-chip power-supply circuit are disposed in diagonally opposed positions.
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