Processes and packaging for high voltage integrated circuits, electronic devices, and circuits
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United States of America Patent
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May 4, 2010
Grant Date -
Apr 3, 2008
app pub date -
Sep 29, 2006
filing date -
Sep 29, 2006
priority date (Note) -
Expired
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Abstract
The present invention includes processes and packaging for high voltage integrated circuits (ICs), high voltage electronic devices and high voltage electronic circuits which operate over a wide range of voltages, e.g., from tens of volts to tens of thousands of volts. The inventive processes and packaging are particularly suitable for integrating low or lower voltage circuits or transistors to form high voltage ICs, high voltage electronic devices and high voltage electronic circuits. The inventive processes and packaging are also particularly suitable for isolating high voltage electronics to achieve high breakdown voltages and for supporting high voltage operation. The inventive processes may be used with any suitable semiconductor materials using conventional semiconductor fabrication and related facilities.
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