Layout architecture having high-performance and high-density design
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United States of America Patent
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Apr 27, 2010
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app pub date -
Nov 17, 2006
filing date -
Jul 20, 2006
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Abstract
A layout architecture having high-performance and high-density design used in a standard cell integrated circuit is provided. The layout architecture includes a substrate, a first conductor, a second conductor, a third conductor, a fourth conductor, a first device region, a second device region, a third device region and a forth device region. The first device region is arranged adjacent to the first conductor on the substrate. The second device region is arranged adjacent to the first device region on the substrate and is arranged beneath the second conductor. The third device region is arranged adjacent to the second device region on the substrate and is arranged beneath the third conductor. The fourth device region is arranged between the third device region and the fourth conductor on the substrate.
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