High silicon-content thin film thermosets

United States of America Patent

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Apr 27, 2010
Grant Date
Jan 10, 2008
app pub date
Jun 22, 2006
filing date
Jun 22, 2006

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Expired

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Abstract

High silicon-content resin composition that can be used to form thin film thermosets, useful in forming low k dielectric constant materials and as well as hard mask materials with anti-reflective properties for the photolithography industry are disclosed.

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Patent Owner	Address
AZ ELECTRONIC MATERIALS USA CORP	70 MEISTER AVENUE SOMERVILLE NJ 08876

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G03F:PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNE....

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Inventor Name	Address	# of filed Patents	Total Citations
Abdallah, David J	Bernardsville, US	17	149
Zhang, Ruzhi	Pennington, US	21	201

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High silicon-content thin film thermosets

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United States of America Patent

11425817

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PATENT NO	7704670
APP PUB NO	20080008954A1
SERIAL NO	11425817
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity Expired	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
April 27, 2010	US,7704670,B2 US7704670B2	GRANTED PATENT AS SECOND PUBLICATION
January 10, 2008	US,20080008954,A1 US20080008954A1	FIRST PUBLISHED PATENT APPLICATION

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11425817

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