Wire bonding apparatus, record medium storing bonding control program, and bonding method
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United States of America Patent
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Apr 20, 2010
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N/A
app pub date -
Dec 28, 2006
filing date -
Dec 28, 2005
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Expired
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Abstract
A bonding method involving detection of non-bonding of a bonding wire to a first bonding point, the method including an electrical non-bonding detection step and an optical non-bonding detection step, wherein data on whether the respective first bonding points are predetermined bonding points where an electrical non-bonding detection is not applicable are acquired from a memory unit; and when it is determined that a first bonding point is the predetermined bonding point, a non-bonding verification on the first bonding point is executed in the optical non-bonding detection step, and when the first bonding point is not the predetermined bonding point, then non-bonding detection on the first bonding point is executed in the electrical non-bonding detection step.
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