Method of making surface-mount coil packages
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United States of America Patent
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Apr 20, 2010
Grant Date -
Sep 11, 2008
app pub date -
Jan 2, 2008
filing date -
Jun 24, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A substrate is prepared that includes substrate segments arranged in series in the X and Y directions. The substrate segments are respectively provided with circuit patterns on its one side and electrodes on the other side. Sets of IC devices including bobbins are mounted on the sides with the circuit patterns of the respective substrates. A conductor is wound around the bobbins successively to form the windings. Portions of the conductor extending between the adjacent windings are pressed against and connected to the circuit patterns to form leading and trailing ends of the windings connected to the circuit patterns. Thereafter, the substrate is severed to provide surface-mount coil packages each comprising the circuit board and the set of IC devices including the coil.
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