Deposition method for oxide thin film or stacked metal thin films using supercritical fluid or subcritical fluid, and deposition apparatus therefor
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United States of America Patent
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Apr 13, 2010
Grant Date -
May 8, 2008
app pub date -
Jun 1, 2005
filing date -
Jun 4, 2004
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Expired
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Abstract
What is provided is a method and an apparatus for easily forming a multilayer structure of conductive metal thin films while forming a metal oxide thin film regardless of the conductivity of a substrate. A thin film of conductive metal is laminated by: dissolving metal precursors for a metal oxide to be formed and an oxidant to oxidize the metal precursors in a supercritical fluid or subcritical fluid; forming a metal oxide thin film by an oxidation reaction on the surface of a substrate in the supercritical fluid or subcritical fluid; then, dissolving a reducing agent and conductive metal precursors in a supercritical fluid or subcritical fluid; while reducing the metal oxide thin film formed on the surface of the substrate to a metal thin film, reducing the conductive metal precursors on the reduced metal thin film.
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