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Country	kind	publication No.	Filing Date	Type	Sub-Type
JP	A	JP2004319677	Apr 15, 2003	Patent	Application
Type : Patent Sub-Type : Application
Published unexamined patent application		REFLOW SOLDERING EQUIPMENT		Nov 11, 2004
JP	B2	JP4131938	Apr 15, 2003	Patent	Grant
Type : Patent Sub-Type : Grant
PUBLISHED GRANTED PATENT (SECOND LEVEL)		REFLOW SOLDERING EQUIPMENT		Aug 13, 2008
KR	B1	KR100883732	May 01, 2003	Patent	Grant
Type : Patent Sub-Type : Grant
PATENT SPECIFICATION		REFLOW SOLDERING DEVICE		Feb 13, 2009
CN	C	CN100459827	May 01, 2003	Patent	Grant
Type : Patent Sub-Type : Grant
GRANTED PATENT FOR INVENTION		Reflow soldering device		Feb 04, 2009
WO	A1	WO2003098982	May 01, 2003	Patent	Application
Type : Patent Sub-Type : Application
INTERNATIONAL APPLICATION PUBLISHED WITH INTERNATIONAL SEARCH REPORT		REFLOW SOLDERING DEVICE		Nov 27, 2003
TW	B	TWI290017	May 12, 2003	Patent	Grant
Type : Patent Sub-Type : Grant
GRANTED PATENT OR PATENT OF ADDITION		Reflow soldering device		Nov 11, 2007

• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
YOKOTA TECHNICA LIMITED COMPANY	TOKYO 1930822

International Classification(s)

• B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....

• 2003 Application Filing Year
• B23K Class
• 1190 Applications Filed
• 515 Patents Issued To-Date
• 43.28 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Yokota, Yatsuharu	Hachioji, JP	10	133
# of filed Patents : 10 Total Citations : 133

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Patent Citation Ranking

• 10 Citation Count
• B23K Class

• 5.77 % this patent is cited more than
• 15 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
April 06, 2010	US,7690550,B2   US7690550B2	GRANTED PATENT AS SECOND PUBLICATION
August 18, 2005	US,20050178814,A1   US20050178814A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 7690550

Reflow soldering apparatus

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Abstract

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are not on a single perpendicular plane along the transport line of the conveyor and arrayed offset to the left and right. This apparatus may also employ a structure wherein the centers of the impellers in the adjacent fans are not on a single horizontal plane and arrayed offset up and down. Further, it may also employ a structure wherein the fans are arranged with their rotation shafts inclined.

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Description

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Claims

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Claims data not available

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Legal Events

 

• MAFP2021
• MAFP2017
• FPAY2013
• CC2010
• I2010
• STCF2010
• P2005
• AS2004
• F2003
• PD2002

Date	Code	Event	Description
Sep 22, 2021	MAFP	MAINTENANCE FEE PAYMENT	free format text: PAYMENT OF MAINTENANCE FEE, 12TH YR, SMALL ENTITY (ORIGINAL EVENT CODE: M2553); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY year of fee payment: 12
Sep 21, 2017	MAFP	MAINTENANCE FEE PAYMENT	free format text: PAYMENT OF MAINTENANCE FEE, 8TH YR, SMALL ENTITY (ORIGINAL EVENT CODE: M2552) year of fee payment: 8
Oct 02, 2013	FPAY	FEE PAYMENT	year of fee payment: 4
Jun 01, 2010	CC	CERTIFICATE OF CORRECTION
Apr 06, 2010	I	Issuance
Mar 17, 2010	STCF	INFORMATION ON STATUS: PATENT GRANT	free format text: PATENTED CASE
Aug 18, 2005	P	Published
Oct 15, 2004	AS	ASSIGNMENT	free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:YOKOTA, YATSUHARU;REEL/FRAME:016552/0139 Owner name: YOKOTA TECHNICA LIMITED COMPANY,JAPAN Effective Date: Oct 15, 2004 free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:YOKOTA, YATSUHARU;REEL/FRAME:016552/0139 Owner name: YOKOTA TECHNICA LIMITED COMPANY, JAPAN Effective Date: Oct 15, 2004
May 01, 2003	F	Filing
May 16, 2002	PD	Priority Date