Reflow soldering apparatus
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United States of America Patent
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Apr 6, 2010
Grant Date -
Aug 18, 2005
app pub date -
May 1, 2003
filing date -
May 16, 2002
priority date (Note) -
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Abstract
are not on a single perpendicular plane along the transport line of the conveyor and arrayed offset to the left and right. This apparatus may also employ a structure wherein the centers of the impellers in the adjacent fans are not on a single horizontal plane and arrayed offset up and down. Further, it may also employ a structure wherein the fans are arranged with their rotation shafts inclined.
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