Method for adhering semiconductor devices
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United States of America Patent
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Mar 30, 2010
Grant Date -
Nov 20, 2008
app pub date -
May 16, 2008
filing date -
May 18, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for adhering semiconductor devices is provided. The method includes forming a first semiconductor device including a first metal pad, forming a second semiconductor device including a second metal pad, adhering the first semiconductor device to the second semiconductor device, the first metal pad electrically connecting the second metal pad, and forming a heat sink via in the second semiconductor device.
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