Method for structuring a substrate surface
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United States of America Patent
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Mar 30, 2010
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N/A
app pub date -
Jun 30, 2004
filing date -
Jul 11, 2003
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Abstract
In a method for structuring the surface of a substrate, a substrate is elastically expanded by the application of a tensile stress so that a surface area of the substrate in which a structure is to be created, is enlarged. Then, in the surface area, a structure is produced that is larger than the structure to be produced. For this purpose at least one solution is applied to the substrate, which solvent contains at least one solid substance dissolved in a solvent. The solvent is then removed from the surface of the substrate so that the solid substance remains behind. The expansion of the substrate is at least partly reversed by the reduction or removal of the tensile stress so that the size of the structure is reduced to the size of the structure to be produced. In the material of the substrate, a compression stress can also be created to reduce the size of the structure to the size of the structure to be produced.
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