Method for bonding substrates and method for irradiating particle beam to be utilized therefor
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United States of America Patent
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Mar 30, 2010
Grant Date -
Aug 11, 2005
app pub date -
Aug 27, 2004
filing date -
Aug 29, 2003
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Abstract
A substrate bonding method for mutually bonding substrates, has a first radiation step for irradiating the surfaces of the individual substrates with an oxygen particle beam, a second radiation step for irradiating the surfaces of the individual substrate with a nitrogen particle beam simultaneously with or subsequently to the first radiation step, and a step for stacking the individual substrates and bringing the surfaces thereof into close contact. Particularly, the substrates which have been irradiated first with an oxygen plasma and subsequently with a nitrogen plasma are stacked and bonded.
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