Multi-layer capacitor and integrated circuit module
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United States of America Patent
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Mar 23, 2010
Grant Date -
Jan 24, 2008
app pub date -
Jun 25, 2004
filing date -
Jun 25, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A multi-layer capacitor includes several electrically insulating layers that are stacked on top of one another. Parallel electrode plates are arranged between the insulating layers alternately one on top of the other, with each of the plates being separated by an intervening insulating layer. At least one first connecting line which extends perpendicularly through the layers is connected to one set of electrode plates and is insulated in relation to the other set of second electrode plates. Similarly, second connecting lines extend perpendicularly through the layers and are connected to the other set of plates and are insulated in relation to the one set of plates. The first connecting line extends centrally through the stacked electrode plates and is designed to carry a high-frequency signal.
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