Radiation cross-linkable hot-melt contact adhesives
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United States of America Patent
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Mar 23, 2010
Grant Date -
Feb 14, 2008
app pub date -
Aug 9, 2007
filing date -
Feb 10, 2005
priority date (Note) -
Expired
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Abstract
The invention relates to a radiation crosslinkable hot melt pressure sensitive adhesive comprised of a radiation crosslinkable polymer as component (A) based on epoxidized polyolefins, wherein the epoxy groups are not consolidated in blocks; a tackifying resin possessing no epoxy groups as component (B); optionally a low molecular weight oligomer as component (C) that possesses reactive groups that can react with the epoxy groups of component (A); and an additive comprising a photo initiator as component (D).
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