Microcircuit package having ductile layer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 16, 2010
Grant Date -
Jun 5, 2008
app pub date -
Nov 9, 2007
filing date -
Nov 9, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A microcircuit package having a ductile layer between a copper flange and die attach. The ductile layer absorbs the stress between the flange and semiconductor device mounted on the flange, and can substantially reduce the stress applied to the semiconductor device. In addition, the package provides the combination of copper flange and polymeric dielectric with a TCE close to copper, which results in a low stress structure of improved reliability and conductivity.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully