Semiconductor device having high cooling efficiency and method for manufacturing the same
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United States of America Patent
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Mar 16, 2010
Grant Date -
Dec 6, 2007
app pub date -
May 22, 2007
filing date -
Jun 2, 2006
priority date (Note) -
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Abstract
A semiconductor device includes a substrate, a semiconductor chip flip-chip mounted on the substrate, a sealing resin layer sealing the surroundings of the semiconductor chip, and a heat sink bonded to the sealing resin layer through a TIM layer. In addition, a cooling medium is encapsulated in an enclosed space formed on the rear surface of the semiconductor chip.
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