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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
TANAKA DENSHI KOGYO K K	2303-15 YOSHIDA YOSHINOGARI-CHO KANZAKI-GUN SAGA 842-0031

International Classification(s)

• H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Maki, Kazunari	Naka-gun, JP	74	205
# of filed Patents : 74 Total Citations : 205
Nakata, Yuji	Sanda, JP	18	232
# of filed Patents : 18 Total Citations : 232

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• 0 Citation Count
• H01B Class

• 0 % this patent is cited more than
• 15 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
March 16, 2010	US,7678999,B2   US7678999B2	GRANTED PATENT AS SECOND PUBLICATION
May 14, 2009	US,20090120665,A1   US20090120665A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 7678999

Gold alloy wire for bonding wire having high bonding reliability, high roundness of compression ball, high straightness and high resin flowability resistance

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