Apparatus, system and method for use in mounting electronic elements
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United States of America Patent
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Mar 9, 2010
Grant Date -
Oct 11, 2007
app pub date -
Mar 28, 2006
filing date -
Mar 28, 2006
priority date (Note) -
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status (Latency Note)
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Abstract
The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing with a recess in a second surface; a first lead element partially encased by the casing comprising a coupling portion extending interior to the casing generally in a first direction and a chipset portion extending from the first coupling portion at a first acute angle and through an area exposed by the recess; a second lead element partially encased by the casing comprising a second coupling portion extending interior to the casing in a second direction substantially parallel to the first direction and a head portion extending from the second coupling portion at a second acute angle and partially terminating interior to the area exposed by the recess; and the chipset portion comprises a first indentation and a second indentation both extending into the area exposed through the recess.
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