Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 2, 2010
Grant Date -
Aug 18, 2005
app pub date -
Apr 7, 2005
filing date -
Dec 7, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully