Plated pillar package formation
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United States of America Patent
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Mar 2, 2010
Grant Date -
Aug 21, 2008
app pub date -
Feb 16, 2007
filing date -
Feb 16, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method involves plating pillars of electrically conductive material up from a seed layer located on a substrate, surrounding the pillars with a fill material so that the pillars and fill material collectively define a first package, and removing the substrate from the first package.
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