Lead free solder containing Sn, Ag and Bi
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United States of America Patent
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Mar 2, 2010
Grant Date -
Dec 18, 2008
app pub date -
Jan 25, 2008
filing date -
Jun 18, 2007
priority date (Note) -
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Abstract
A lead free solder is provided. The lead free solder includes about 1.5 wt % to about 2.5 wt % silver (Ag), about 3 wt % to about 6 wt % bismuth (Bi), about 0.005 wt % to about 0.1 wt % of a deoxidizing agent, and a balance of tin (Sn). The lead free solder has improved wettability, a lowered melting point, little or substantially no formation of oxidation layer in a solder bath, suppressed brittleness, improved thermal shock resistance and drop resistance.
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