Method of manufacturing a laminated leadframe

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7665205
APP PUB NO 20070119050A1
SERIAL NO

11595757

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Abstract

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Disclosed are a method for manufacturing a laminated lead frame and a laminated lead frame manufactured thereby, wherein lead frame single plates to be laminated one on top of the other can be reliably bonded together with a relatively light load. Under the method for manufacturing a laminated lead frame by means of stacking and bonding lead frame single plates 10 and 11, each of which has been processed into a predetermined shape, a plurality of protuberance sections 12 are formed in at least one of mutually-opposing surfaces of the lead frame single plates 10 and 11 that vertically pair up with each other. The mutually-opposing lead frame single plates 11, 12 are bonded together via the protuberance sections 12.

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Patent Owner(s)

Patent OwnerAddress
MITSUI HIGH-TEC INCFUKUOKA PREFECTURE FUKUOKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsunaga, Kiyoshi Fukuoka, JP 4 33
Mimura, Chikaya Fukuoka, JP 2 47
Shioyama, Takao Fukuoka, JP 2 28

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