Substrate damage detection mechanism using RFID tag
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Feb 16, 2010
Grant Date -
Mar 13, 2008
app pub date -
Aug 30, 2006
filing date -
Aug 30, 2006
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Disclosed is a substrate damage detection mechanism using Radio Frequency Identification (RFID) tag including a substrate, at least one RFID tag with a RFID chip, a RFID transmitter and at least one data input/output port and at least one conducting circuit loop arranged to cover the substrate and provided with a first end that is electrically connected to a reference voltage and a second end that is electrically connected to the data input/output port of the RFID tag. The RFID chip generates a conductive code when the conducting circuit loop is originally conducting and generates a open-circuit code when the conducting circuit loop becomes open circuit resulting from the damage of the substrate in which both the conductive code and the open-circuit code are transmitted by the RFID transmitter and received by a RFID reader to determine the damage of the substrate.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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CHUNG HUA UNIVERSITY | 707 SEC 2 WUFU RD HSINCHU |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Chen, Jwu-E | Hsin Chu, TW | 5 | 103 |
# of filed Patents : 5 Total Citations : 103 | |||
Chen, Tung-Chou | Hsin Chu, TW | 5 | 113 |
# of filed Patents : 5 Total Citations : 113 | |||
Chiu, Chien-Jung | Hsin Chu, TW | 9 | 107 |
# of filed Patents : 9 Total Citations : 107 | |||
Chung, In-Hang | Hsin Chu, TW | 4 | 102 |
# of filed Patents : 4 Total Citations : 102 | |||
Hwang, Chi-Kuang | Hsin Chu, TW | 13 | 235 |
# of filed Patents : 13 Total Citations : 235 | |||
Lee, Bore-Kuen | Hsin Chu, TW | 4 | 102 |
# of filed Patents : 4 Total Citations : 102 | |||
Tien, Ching-Cheng | Hsin Chu, TW | 13 | 256 |
# of filed Patents : 13 Total Citations : 256 | |||
Wang, Chih-Hu | Hsin Chu, TW | 4 | 84 |
# of filed Patents : 4 Total Citations : 84 | |||
Wu, Chia-Wen | Hsin Chu, TW | 21 | 167 |
# of filed Patents : 21 Total Citations : 167 | |||
Yen, Ming-Ching | Hsin Chu, TW | 11 | 133 |
# of filed Patents : 11 Total Citations : 133 |
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

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Oct 16, 2023 | LAPS | LAPSE FOR FAILURE TO PAY MAINTENANCE FEES | free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: SMALL ENTITY |
Oct 16, 2023 | STCH | INFORMATION ON STATUS: PATENT DISCONTINUATION | free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
Sep 13, 2023 | FP | LAPSED DUE TO FAILURE TO PAY MAINTENANCE FEE | Effective Date: Sep 13, 2023 |
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Feb 20, 2015 | FPAY | FEE PAYMENT | year of fee payment: 4 |
Sep 13, 2011 | I | Issuance | |
Aug 24, 2011 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
May 19, 2011 | ZAAB | NOTICE OF ALLOWANCE MAILED | free format text: ORIGINAL CODE: MN/=. |
May 18, 2011 | ZAAA | NOTICE OF ALLOWANCE AND FEES DUE | free format text: ORIGINAL CODE: NOA |
Apr 19, 2007 | P | Published | |
Sep 29, 2006 | F | Filing | |
Sep 30, 2005 | PD | Priority Date |

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